# Keeping the line running when chambers go down **URL:** \ **Category:** Blog\ **Created:** [March 17, 2026, 12:00am UTC](https://community.criticalmanufacturing.com/t/keeping-the-line-running-when-chambers-go-down/741 "2026-03-17T00:00:00Z")\ **Posts on this page:** 1\ **Page:** 1
**Author:** ![Jose\_Goncalves](https://avatars.discourse-cdn.com/v4/letter/j/c37758/32.png) [@Jose\_Goncalves](https://community.criticalmanufacturing.com/u/Jose_Goncalves)\ **Post date:** [March 17, 2026, 12:00am UTC](https://community.criticalmanufacturing.com/t/keeping-the-line-running-when-chambers-go-down/741/1 "2026-03-17T00:00:00Z")
This blog explains how chamber dependencies can be modeled and managed within the MES for Semiconductor Equipment, particularly in cluster tools composed of multiple process chambers. In these systems, each chamber provides its own service, while the equipment-level services depend on the real-time availability and interaction of those chambers. Understanding these dependencies is essential for ensuring accurate equipment capabilities, optimized scheduling, and ensuring that production can continue to run even when one or more chambers are fully unavailable or just for some services ### Introduction In semiconductor industry, cluster equipment (Resources) can be composed of multiple chambers (Sub-Resources), each capable of delivering its own Capability (service). The capabilities provided by the cluster tool are therefore composite and depend on the availability of the individual chambers. **Etching Cluster Tools** Vendors often integrate multiple etch chambers into one platform and each chamber can run different etch chemistries. Chambers may specialize in: oxide etch, nitride etch, metal etch, poly etch, high‑aspect‑ratio etch, etc. When one or more chambers go down, they can be removed from the Cluster to be repaired. This doesn’t mean a full production shutdown. Products that don’t depend on the capabilities of the affected chambers can still run. ![Etching Cluster Tool](https://canada1.discourse-cdn.com/flex050/uploads/community_criticalmanufacturing/original/1X/8801986527ca85474f9a9a9820698a31f1c12bc3.jpeg "Etching Cluster Tool") _Etching Cluster Tool_ **Sputtering or Metal Deposition Equipment** Sputtering tools are one of the clearest and most common examples of true cluster equipment in semiconductor fabs. They typically include: - A central transfer module (Load Lock) with a robot - Multiple process chambers, each performing a different metal deposition - Each chamber can be independently used and repaired without stopping production. Although more common in Semiconductor Industry, this scenario can also exist in other industries **Plasma Surface Treatment Tool for Medical Device Industry** Used for instance for catheter bonding prep, stent surface activation, syringe barrel cleaning. These equipment have typically a central load/unload, a set of plasma chambers in parallel and each one of them can run different gas recipes. When one of the chambers is down and no alternative is available, some products that depend on that chamber may be forced to stop, while other products can continue to be manufactured ![Plasma Surface Treatment Tool](https://canada1.discourse-cdn.com/flex050/uploads/community_criticalmanufacturing/original/1X/7f838b7749b396c4af0c8dc839cca38a2b6e143a.jpeg "Plasma Surface Treatment Tool") _Plasma Surface Treatment Tool_ The use case shown in the demo below refers to the Metal Deposition process performed on a NEXX Sputter tool. Sputtering is a physical vapor deposition (PVD) technique widely used to deposit thin metal layers onto semiconductor wafers and it’s one specific technique of Metal Deposition process. It works by: 1. Creating plasma 2. Accelerating ions toward a metal target. 3. Condensing those atoms onto a wafer, forming a uniform, high‑purity film. Sputtering is ideal for a wide range of metals used in semiconductors industries, such as: - Aluminum (Al) - Copper (Cu) - Zinc (Zn) - Silver (Ag) - And other materials ### 📝Use Case A Sputtering Tool with 5 Chambers ![Sputtering Tool](https://canada1.discourse-cdn.com/flex050/uploads/community_criticalmanufacturing/original/1X/4c529d95fc56705adeb10beed3f9a6bedd1e3a0f.jpeg "Sputtering Tool with 5 chambers") _Sputtering Tool with 5 chambers_ The chambers are generally prepared to perform any deposition process. However, each chamber can only execute one Metal Deposition operation at a time (The chamber supports only one target at a time). The current operational status of each chamber is shown below ![Chambers Configurations](https://canada1.discourse-cdn.com/flex050/uploads/community_criticalmanufacturing/original/1X/9acbdf3d42c1e05d54f8cfa7c5bcd752c85cd188.png "Chambers Configurations") _Chambers Configurations_ In this use case, we have three different products, each requiring distinct deposition processes. The required process recipe defines the deposition sequence ![Metal deposition by Product](https://canada1.discourse-cdn.com/flex050/uploads/community_criticalmanufacturing/original/1X/a4b047040cc9b1c911209bb4dc71fb2497ef849e.png "Metal deposition Sequence by Product") _Metal deposition Sequence by Product_ For product “2EDN7524F”, the process requires an initial Aluminum deposition (qualified on CHB‑001 and CHB‑003) onto all the wafers, followed by a silver deposition step performed in CHB‑004 For product “KommSemi Generic Brand Gate Driver”, all the wafers require an initial silver deposition qualified on CHB‑004, followed by a Zinc deposition step performed in CHB‑005 and finally a Copper Deposition on CHB-002 For product “2EGN7524G”, all wafers require an initial Copper deposition, which is available on CHB‑002. This is followed by an Aluminum deposition that may be executed on either CHB‑001 or CHB‑003, and finally a Zinc deposition step performed on CHB‑005 ### ⚙️MES SETUP 1st) The Sputtering Tool provides 3 different Main Services ![Resource Service](https://canada1.discourse-cdn.com/flex050/uploads/community_criticalmanufacturing/original/1X/0df11ac0f732cf0b415a2dff9fc5f37f17d19262.png) 2nd) Each one of the services is required by different products ![Service COntext](https://devblog.criticalmanufacturing.com/blogPosts/posts/20260309\_keeping\_line\_running/Picture2026-03-02\_7.png) 3rd) The Main service “Sputtering Al\_Ag” requires the sub-services “Aluminum Deposition” and “Silver Deposition” provide respectively by the Chambers “CHB-001 or CHB-003” and “CHB-004”. The Main service “Sputtering Cu\_Al\_Zn” requires the sub-services “Copper Deposition” and “Aluminum Deposition” and “Zinc Deposition” provide respectively by the Chambers “CHB-002”, “CHB-001 or CHB-003” and “CHB-005”. The Main service “Sputtering Ag\_Zn\_Cu” requires the sub-services “Silver Deposition” and “Zinc Deposition” and “Copper Deposition” provide respectively by the Chambers “CHB-004”, “CHB-005” and “CHB-002”. ### DEMO https://customer-40kvzg4z7gkyofrp.cloudflarestream.com/79c067b1d9b49ff88657b9fc8203e58d/iframe?poster=https%3A%2F%2Fcustomer-40kvzg4z7gkyofrp.cloudflarestream.com%2F79c067b1d9b49ff88657b9fc8203e58d%2Fthumbnails%2Fthumbnail.jpg%3Ftime%3D%26height%3D600 Note: Since the Aluminum Deposition Service can be executed by two different chambers, whenever this service is requested, the MES Running Mode functionality can be leveraged to dynamically select and trigger the appropriate process recipe based on the specific chamber allocated for execution ### Final thoughts Even if a chamber goes down, MES keeps production moving by tracking which chambers are available in real time and which products can run. This way, many products can still run without major disruption. It’s a simple way to keep the line productive, even when equipment isn’t at full capacity. ### Author Hi! My name is José Romeu Bogas Gonçalves. 😉 I’ve been with Critical Manufacturing since 2018, starting out as an MES Consultant. In 2025 I stepped into the Advocate & Architecture team. My role sits at the intersection of technology, communication, and strategy. Making sure solutions are technically sound and that everyone understands how to use or build them. You can check me on [LinkedIn](https://www.linkedin.com/in/romeu-gon%C3%A7alves-63724113/) Skills: MES Consultant | System Testing | System Modeling | User Training | Content Creating ![Romeu Gonçalves](https://canada1.discourse-cdn.com/flex050/uploads/community_criticalmanufacturing/original/1X/2c18017853ab78fe77412f50daf442fcca7f7521.jpeg "Architecture & Advocacy | MES") _Architecture & Advocacy | MES_ * * * This is a companion discussion topic for the original entry at [https://devblog.criticalmanufacturing.com/blog/20260309\_keeping\_the\_line\_running\_when\_a\_chamber\_goes\_down/](https://devblog.criticalmanufacturing.com/blog/20260309_keeping_the_line_running_when_a_chamber_goes_down/)