Question on Using Map and Map Definition Feature

Modelling & Configuration
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1

Hello- trying to use Map and Map Definition feature in MES for semiconductor application. Have any of you used it and did you have to add more customizations to make it better? Also, I couple of more questions:

  1. Can I map out defect for each layer and will the defect on the die or wafer be highlighted to indicate it has defect as we continue to build more layers on the wafer? For example, if I have defect on Wafer 1, layer 1, and on die 1, 5 and 10. When I go to layer 2, will I be able to see on the map that the wafer 1, die 1, 5, and 10 has defect since it’s highlighted with different color?
  2. Can I save the images for the defects detected and able to access from MES directly?

Thank you in advance for your help.